Inventor
SU YEN-FU
TW5 patents
Patents
5 patentsUS11894341B2Feb 6, 2024
Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11705408B2Jul 18, 2023
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11004812B2May 11, 2021
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12362321B2Jul 15, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12230589B2Feb 18, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62