Inventor

TRUONG FRANK

US19 patents

⚠️ This page may combine multiple inventors who share the name “TRUONG FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TRUONG FRANK

INTEL CORP

Magnetic material having coated ferromagnetic filler particles

Embedded multi-die interconnect bridge having a molded region with through-mold vias

Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch

Dielectric film with pressure sensitive microcapsules of adhesion promoter

Package-integrated vertical capacitors and methods of assembling same

High density package substrate formed with dielectric bi-layer

Package-integrated vertical capacitors and methods of assembling same

Microelectronic assemblies having conductive structures with different thicknesses

Magnetic material having coated ferromagnetic filler particles

Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias

Dual side de-bonding in component carriers using photoablation

Capacitors with nanoislands on conductive plates

Build-up high-aspect ratio opening

Electronic device including a substrate having interconnects

Selective deposition of embedded thin-film resistors for semiconductor packaging

Raster-planarized substrate interlayers and methods of planarizing same

TRUONG FRANK

Device and method for the implantation of active fixation medical leads

Implant tool for active fixation lead

MICROSOFT CORP

Systems and methods for gathering, organizing and executing test cases