Inventor
LEE BOB
TW29 patents
⚠️ This page may combine multiple inventors who share the name “LEE BOB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SQUARE INC
17 patentsUS9264850B1Feb 16, 2016
Multiple merchants in cardless payment transactions and multiple customers in cardless payment transactions
SQUARE INC50 citations98
US8997230B1Mar 31, 2015
Hierarchical data security measures for a mobile device
SQUARE INC42 citations97
US8606703B1Dec 10, 2013
Method for transferring money using email
SQUARE INC125 citations97
US9113344B1Aug 18, 2015
Detecting location using WiFi hotspots
SQUARE INC28 citations94
US10409984B1Sep 10, 2019
Hierarchical data security measures for a mobile device
SQUARE INC17 citations93
US9451397B1Sep 20, 2016
Detecting proximity using WiFi hotspots
SQUARE INC21 citations92
US9367842B2Jun 14, 2016
Software pin entry
SQUARE INC13 citations92
US9055400B1Jun 9, 2015
Detecting proximity using WiFi hotspots
SQUARE INC23 citations92
US10373151B1Aug 6, 2019
Multiple merchants in cardless payment transactions and multiple customers in cardless payment transactions
SQUARE INC5 citations84
US9838840B1Dec 5, 2017
Detecting proximity using WiFi hotspots
SQUARE INC12 citations84
US9730015B1Aug 8, 2017
Detecting location using WiFi hotspots
SQUARE INC11 citations84
US9648451B1May 9, 2017
Multiple merchants in cardless payment transactions and multiple customers in cardless payment transactions
SQUARE INC11 citations84
US10515363B2Dec 24, 2019
Software PIN entry
SQUARE INC4 citations83
US10083442B1Sep 25, 2018
Software PIN entry
SQUARE INC6 citations83
US9536232B2Jan 3, 2017
Transferring money using email
SQUARE INC13 citations83
US9378499B2Jun 28, 2016
Software PIN entry
SQUARE INC7 citations83
US10185957B2Jan 22, 2019
Software pin entry
SQUARE INC3 citations72
TEXAS INSTRUMENTS INC
7 patentsUS11302652B2Apr 12, 2022
Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die
TEXAS INSTRUMENTS INC8 citations81
US11791289B2Oct 17, 2023
Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die
TEXAS INSTRUMENTS INC2 citations69
US12476204B2Nov 18, 2025
Semiconductor package substrate with groove on die pad
TEXAS INSTRUMENTS INC0 citations58
US10910293B1Feb 2, 2021
Leadframe with die pad having cantilevers to secure electronic component
TEXAS INSTRUMENTS INC1 citations58
US12489037B2Dec 2, 2025
Semiconductor package substrate with a smooth groove straddling topside and sidewall
TEXAS INSTRUMENTS INC0 citations53
US12062596B2Aug 13, 2024
Semiconductor die with stepped side surface
TEXAS INSTRUMENTS INC0 citations52
US9786582B2Oct 10, 2017
Planar leadframe substrate having a downset below within a die area
TEXAS INSTRUMENTS INC0 citations51