Inventor

KANG IN KU

KR41 patents

⚠️ This page may combine multiple inventors who share the name “KANG IN KU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANG IN KU

SAMSUNG ELECTRONICS CO LTD

Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate

Semiconductor chip stack structure

Semiconductor package and method of forming

Semiconductor package having step type die and method for manufacturing the same

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Semiconductor packages and electronic systems including the same

Chip stack package and manufacturing method thereof

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Multi-chip package and method for manufacturing the same

Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit package

Wire bonding method, semiconductor chip, and semiconductor package

Electronic device and method for processing secure information

Multi-chip module having bonding wires and method of fabricating the same

Bumped chip carrier package using lead frame

Integrated circuit package including shielding between adjacent chips

Semiconductor package having adhesive layer and method of manufacturing the same

Semiconductor package and method of fabricating the same

Bumped chip carrier package using lead frame and method for manufacturing the same

Method and apparatus for bonding a wire

Electronic device and method for commonly using the same

Method for managing network access and electronic device therefor

Method and electronic device for updating configuration settings

SK HYNIX INC

Semiconductor device with ferroelectricity

Resistive memory device and manufacturing method of the resistive memory device

Resistive memory device and method of operating the resistive memory device

Resistive memory device and manufacturing method of the resistive memory device

Semiconductor device and manufacturing method of the semiconductor device

Method of forming a stacked memory structure with insulating patterns

Resistive memory device and method of operating the resistive memory device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Stacked memory structure with insulating patterns

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of the semiconductor device

Semiconductor device and manufacturing method of a semiconductor device

SAMSUNG ELECTORNICS CO LTD

Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof

KIM KYUNG-MAN

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

KANG IN-KU

Semiconductor package and manufacturing method thereof