P

Inventor

CHOI JAE SIK

KR34 patents
⚠️ This page may combine multiple inventors who share the name “CHOI JAE SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAGNACHIP SEMICONDUCTOR LTD

16 patents
US11011445B2May 18, 2021

Semiconductor package device

MAGNACHIP SEMICONDUCTOR LTD2 citations68
US10276673B2Apr 30, 2019

Semiconductor die having stacking structure of silicon-metallic conductive layer-silicon

MAGNACHIP SEMICONDUCTOR LTD2 citations68
US10910270B2Feb 2, 2021

Method of forming and packaging semiconductor die

MAGNACHIP SEMICONDUCTOR LTD6 citations66
US11233000B2Jan 25, 2022

Semiconductor package with inner lead pattern group and method for manufacturing the semiconductor package

MAGNACHIP SEMICONDUCTOR LTD0 citations62
US11081419B2Aug 3, 2021

Semiconductor package and a method of manufacturing the same

MAGNACHIP SEMICONDUCTOR LTD0 citations60
US11901322B2Feb 13, 2024

Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die

MAGNACHIP SEMICONDUCTOR LTD0 citations59
US11380640B2Jul 5, 2022

Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die

MAGNACHIP SEMICONDUCTOR LTD0 citations59
US11887892B2Jan 30, 2024

Method for forming semiconductor die with die region and seal-ring region

MAGNACHIP SEMICONDUCTOR LTD0 citations56
US10741521B2Aug 11, 2020

Semiconductor package and method of manufacturing semiconductor package

MAGNACHIP SEMICONDUCTOR LTD0 citations50
US10347565B2Jul 9, 2019

Multi-chip package of power semiconductor

MAGNACHIP SEMICONDUCTOR LTD0 citations50
US12456651B2Oct 28, 2025

Semiconductor die forming and packaging method using ultrashort pulse laser micromachining

MAGNACHIP SEMICONDUCTOR LTD0 citations49
US10269677B2Apr 23, 2019

Semiconductor package and a method of manufacturing the same

MAGNACHIP SEMICONDUCTOR LTD0 citations49
US10705116B2Jul 7, 2020

Test socket of flexible semiconductor chip package and bending test method using the same

MAGNACHIP SEMICONDUCTOR LTD0 citations48
US10431530B2Oct 1, 2019

Power semiconductor module and method for manufacturing the same

MAGNACHIP SEMICONDUCTOR LTD0 citations48
US9893000B2Feb 13, 2018

Power semiconductor module and method for manufacturing the same

MAGNACHIP SEMICONDUCTOR LTD0 citations48
US10644121B2May 5, 2020

Semiconductor die having stacking structure of silicon-metallic conductive layer-silicon

MAGNACHIP SEMICONDUCTOR LTD0 citations47

HYUNDAI MOTOR CO LTD

9 patents

CHOI JAE SIK

3 patents

LG PHILIPS LCD CO LTD

2 patents

LG DISPLAY CO LTD

1 patent

ULSAN NAT INST SCIENCE & TECH UNIST

1 patent

VAN SCHAFTINGEN JULES-JOSEPH

1 patent

SaferZone

1 patent