Inventor

HIRAFUNE SAYAKA

JP3 patents

⚠️ This page may combine multiple inventors who share the name “HIRAFUNE SAYAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJIKURA LTD

2 patents

US7274101B2Sep 25, 2007

Semiconductor package and method for manufacturing the same

FUJIKURA LTD42 citations89

US7368321B2May 6, 2008

Semiconductor package and method for manufacturing the same

FUJIKURA LTD2 citations60

OLYMPUS CORP

1 patent

US7180149B2Feb 20, 2007

Semiconductor package with through-hole

OLYMPUS CORP110 citations96