Inventor

MIN CHUNG-KI

KR14 patents

⚠️ This page may combine multiple inventors who share the name “MIN CHUNG-KI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

11 patents

US7156722B2Jan 2, 2007

Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the same

SAMSUNG ELECTRONICS CO LTD13 citations84

US8039372B2Oct 18, 2011

Methods of manufacturing variable resistance non-volatile memory devices including a uniformly narrow contact layer

SAMSUNG ELECTRONICS CO LTD10 citations83

US10535679B2Jan 14, 2020

Semiconductor device including stack structures having R-type pad and P-type pad of different thickness

SAMSUNG ELECTRONICS CO LTD4 citations72

US11637019B2Apr 25, 2023

Method for forming a semiconductor device having protrusion structures on a substrate and a planarized capping insulating layer on the protrusion structures

SAMSUNG ELECTRONICS CO LTD2 citations68

US7713879B2May 11, 2010

Chemical mechanical polishing method

SAMSUNG ELECTRONICS CO LTD2 citations63

US11145672B2Oct 12, 2021

Semiconductor device including stack structures having gate pads with different thicknesses

SAMSUNG ELECTRONICS CO LTD0 citations62

US7589013B2Sep 15, 2009

Electrode structure and method of manufacturing the same, phase-change memory device having the electrode structure and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations62

US7025493B2Apr 11, 2006

Apparatus for polishing a wafer and method for fabricating a semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD0 citations48

PARK JOON-SANG

1 patent

US8133756B2Mar 13, 2012

Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same

PARK JOON-SANG8 citations77

KIM DONG-KEUN

1 patent

US8592315B2Nov 26, 2013

Chemical mechanical polishing method

KIM DONG-KEUN2 citations62

MIN CHUNG-KI

1 patent

US8975731B2Mar 10, 2015

Semiconductor device having an insulating layer structure and method of manufacturing the same

MIN CHUNG-KI3 citations55

MIN CHUNG-KI

SAMSUNG ELECTRONICS CO LTD

Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the same

Methods of manufacturing variable resistance non-volatile memory devices including a uniformly narrow contact layer

Semiconductor device including stack structures having R-type pad and P-type pad of different thickness

Method for forming a semiconductor device having protrusion structures on a substrate and a planarized capping insulating layer on the protrusion structures

Chemical mechanical polishing method

Semiconductor device including stack structures having gate pads with different thicknesses

Electrode structure and method of manufacturing the same, phase-change memory device having the electrode structure and method of manufacturing the same

Chemical supply system and chemical mixing apparatus

Semiconductor device and method of manufacturing the same

Semiconductor device with a stacked structure and a capping insulation layer

Apparatus for polishing a wafer and method for fabricating a semiconductor device using the same

PARK JOON-SANG

Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same

KIM DONG-KEUN

Chemical mechanical polishing method

MIN CHUNG-KI

Semiconductor device having an insulating layer structure and method of manufacturing the same