Inventor

YANG SU-CHUN

TW22 patents

⚠️ This page may combine multiple inventors who share the name “YANG SU-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANG SU-CHUN

TAIWAN SEMICONDUCTOR MFG CO LTD

Bonding method of package components and bonding apparatus

Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device

Package structure

Bonding with pre-deoxide process and apparatus for performing the same

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device

Bonding method of package components and bonding apparatus

Bonding with pre-deoxide process and apparatus for performing the same

Package structure and method for forming the same

Die stacking structure, semiconductor package and formation method of the die stacking structure

Integrated circuit packages and methods of forming the same

Chip package structure with redistribution layer having bonding portion

Chip package structure and method for forming the same

Solder bump stretching method

Metal post bonding using pre-fabricated metal posts

Thinning process using metal-assisted chemical etching

Solder bump stretching method and device for performing the same

Solder bump stretching method for forming a solder bump joint in a device

Solder bump joint in a device including lamellar structures

Method of implanting semiconductor donor substrate and method of manufacturing semiconductor-on-insulator structure

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG

Method for manufacturing a plurality of metal posts