Inventor

CHAI SEUNGYONG

KR10 patents

⚠️ This page may combine multiple inventors who share the name “CHAI SEUNGYONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC PTE LTD

5 patents

US9997468B2Jun 12, 2018

Integrated circuit packaging system with shielding and method of manufacturing thereof

STATS CHIPPAC PTE LTD5 citations84

US11145603B2Oct 12, 2021

Integrated circuit packaging system with shielding and method of manufacture thereof

STATS CHIPPAC PTE LTD0 citations62

US11024585B2Jun 1, 2021

Integrated circuit packaging system with shielding and method of manufacture thereof

STATS CHIPPAC PTE LTD0 citations62

US10319684B2Jun 11, 2019

Dummy conductive structures for EMI shielding

STATS CHIPPAC PTE LTD0 citations50

US10109587B1Oct 23, 2018

Integrated circuit packaging system with substrate and method of manufacture thereof

STATS CHIPPAC PTE LTD0 citations49

CUONG DAO NGUYEN PHU

1 patent

US9412624B1Aug 9, 2016

Integrated circuit packaging system with substrate and method of manufacture thereof

CUONG DAO NGUYEN PHU6 citations76

YUN JAEUN

1 patent

US8524537B2Sep 3, 2013

Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue

YUN JAEUN4 citations57

STATS CHIPPAC LTD

1 patent

US9279673B2Mar 8, 2016

Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage

STATS CHIPPAC LTD1 citations50

KO WONJUN

1 patent

US8067275B2Nov 29, 2011

Integrated circuit package system with package integration

KO WONJUN0 citations49

CHAI SEUNGYONG

1 patent

US8518822B2Aug 27, 2013

Integrated circuit packaging system with multi-stacked flip chips and method of manufacture thereof

CHAI SEUNGYONG0 citations44