Inventor · disambiguated record
Jun-Hyuk Kwon
Also filed as: KWON JUN HYUK
5 granted patents·3 pending applications·1 citations·filing 2011–2018
60Inventor score
Top patents by PatentIndex Score
8 records- 0148US9517612B2Floor material using PLA resinHUANG CHENG-ZHE·Filed 2011·Granted Dec 13, 2016·1 cites·15 claims
- 0245US9657482B2Floor panel having adhesive applied sheetLG HAUSYS LTD·Filed 2013·Granted May 23, 2017·0 cites·7 claims
- 0344US2014360117A1Flooring using pvc and method of constructing the flooringLG HAUSYS LTD·Filed 2013·Application pending·0 cites
- 0443US10840642B2Connector assembly and method of manufacturing socket for connector assemblyTYCO ELECTRONICS AMP KOREA CO LTD·Filed 2018·Granted Nov 17, 2020·0 cites·17 claims
- 0540US2014370225A1Flooring material using poly lactic acid resin and construction methods of the sameLG HAUSYS LTD·Filed 2012·Application pending·0 cites
- 0638US9422729B2Chip-inlaid flooring material using PLA resinKWON HYUN-JONG·Filed 2011·Granted Aug 23, 2016·0 cites·15 claims
- 0735US2013004703A1Board complex having pla coverLG HAUSYS LTD·Filed 2011·Application pending·0 cites
- 0833US9623635B2Chip through flooring material using PLA resinHUANG CHENG-ZHE·Filed 2011·Granted Apr 18, 2017·0 cites·12 claims
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