Inventor · disambiguated record
Hyun-Suk Chun
Also filed as: CHUN HYUN-SUK
2 granted patents·2 pending applications·0 citations·filing 2014–2016
23Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0140US9368465B2Method of forming bump pad structure having buffer patternSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 14, 2016·0 cites·20 claims
- 0236US10014267B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 3, 2018·0 cites·15 claims
- 0334US2015221625A1Semiconductor package having a dissipating plateCHUN HYUN-SUK·Filed 2014·Application pending·0 cites
- 0426US2017136669A1Molding apparatus for semiconductor package fabrication and method of molding semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →