Inventor
MURUGAN SANJAY KUMAR
MY11 patents
⚠️ This page may combine multiple inventors who share the name “MURUGAN SANJAY KUMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
9 patentsUS10347554B2Jul 9, 2019
Spatially selective roughening of encapsulant to promote adhesion with functional structure
INFINEON TECHNOLOGIES AG7 citations81
US11621204B2Apr 4, 2023
Molded semiconductor module having a mold step for increasing creepage distance
INFINEON TECHNOLOGIES AG3 citations64
US12068213B2Aug 20, 2024
Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof
INFINEON TECHNOLOGIES AG0 citations60
US12334414B2Jun 17, 2025
Power semiconductor device with dual heat dissipation structures
INFINEON TECHNOLOGIES AG0 citations56
US11908771B2Feb 20, 2024
Power semiconductor device with dual heat dissipation structures
INFINEON TECHNOLOGIES AG1 citations56
US11211356B2Dec 28, 2021
Power semiconductor package and method for fabricating a power semiconductor package
INFINEON TECHNOLOGIES AG0 citations53
US11362023B2Jun 14, 2022
Package lead design with grooves for improved dambar separation
INFINEON TECHNOLOGIES AG0 citations50
US10457001B2Oct 29, 2019
Method for forming a matrix composite layer and workpiece with a matrix composite layer
INFINEON TECHNOLOGIES AG0 citations47
US10431526B2Oct 1, 2019
Rivetless lead fastening for a semiconductor package
INFINEON TECHNOLOGIES AG0 citations34