Inventor
TEJWANI MANU JAMNADAS
US5 patents
Patents
5 patentsUS6030895AFeb 29, 2000
Method of making a soft metal conductor
IBM55 citations95
US5897370AApr 27, 1999
High aspect ratio low resistivity lines/vias by surface diffusion
IBM89 citations94
US5731245AMar 24, 1998
High aspect ratio low resistivity lines/vias with a tungsten-germanium alloy hard cap
IBM52 citations94
US6285082B1Sep 4, 2001
Soft metal conductor
IBM28 citations91
US5877084AMar 2, 1999
Method for fabricating high aspect ratio low resistivity lines/vias by surface reaction
IBM17 citations91