Inventor
WOOSLEY ALAN H
US9 patents
⚠️ This page may combine multiple inventors who share the name “WOOSLEY ALAN H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
4 patentsUS5517056AMay 14, 1996
Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same
MOTOROLA INC239 citations98
US5233222AAug 3, 1993
Semiconductor device having window-frame flag with tapered edge in opening
MOTOROLA INC64 citations94
US5656549AAug 12, 1997
Method of packaging a semiconductor device
MOTOROLA INC38 citations88
US5344600ASep 6, 1994
Method for encapsulating semiconductor devices with package bodies
MOTOROLA INC39 citations88
FREESCALE SEMICONDUCTOR INC
3 patentsUS6998952B2Feb 14, 2006
Inductive device including bond wires
FREESCALE SEMICONDUCTOR INC137 citations97
US7105383B2Sep 12, 2006
Packaged semiconductor with coated leads and method therefore
FREESCALE SEMICONDUCTOR INC16 citations81
US7015585B2Mar 21, 2006
Packaged integrated circuit having wire bonds and method therefor
FREESCALE SEMICONDUCTOR INC2 citations61