Inventor
GOH SOON LOCK
MY11 patents
⚠️ This page may combine multiple inventors who share the name “GOH SOON LOCK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
9 patentsUS10396007B2Aug 27, 2019
Semiconductor package with plateable encapsulant and a method for manufacturing the same
INFINEON TECHNOLOGIES AG4 citations71
US10431560B2Oct 1, 2019
Molded semiconductor package having an optical inspection feature
INFINEON TECHNOLOGIES AG2 citations67
US9806043B2Oct 31, 2017
Method of manufacturing molded semiconductor packages having an optical inspection feature
INFINEON TECHNOLOGIES AG2 citations67
US9852918B2Dec 26, 2017
Embedding additive particles in encapsulant of electronic device
INFINEON TECHNOLOGIES AG2 citations66
US11081417B2Aug 3, 2021
Manufacturing a package using plateable encapsulant
INFINEON TECHNOLOGIES AG1 citations60
US7955901B2Jun 7, 2011
Method for producing a power semiconductor module comprising surface-mountable flat external contacts
INFINEON TECHNOLOGIES AG6 citations59
US9287238B2Mar 15, 2016
Leadless semiconductor package with optical inspection feature
INFINEON TECHNOLOGIES AG1 citations51
US7838332B2Nov 23, 2010
Method of manufacturing a semiconductor package with a bump using a carrier
INFINEON TECHNOLOGIES AG1 citations51
US9540539B2Jan 10, 2017
Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
INFINEON TECHNOLOGIES AG0 citations34