Inventor
OI SOTARO
JP19 patents
⚠️ This page may combine multiple inventors who share the name “OI SOTARO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI MATERIALS CORP
14 patentsUS10211068B2Feb 19, 2019
Power-module substrate with cooler and method of producing the same
MITSUBISHI MATERIALS CORP4 citations72
US11476127B2Oct 18, 2022
Manufacturing method of electronic-component-mounted module
MITSUBISHI MATERIALS CORP3 citations71
US10032648B2Jul 24, 2018
Method of manufacturing power-module substrate with heat-sink
MITSUBISHI MATERIALS CORP4 citations71
US9615442B2Apr 4, 2017
Power module substrate and power module
MITSUBISHI MATERIALS CORP5 citations71
US11302602B2Apr 12, 2022
Power-module substrate with heat-sink
MITSUBISHI MATERIALS CORP2 citations70
US10607915B2Mar 31, 2020
Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device
MITSUBISHI MATERIALS CORP3 citations70
US10453772B2Oct 22, 2019
Heat-sink-attached power-module substrate and power module
MITSUBISHI MATERIALS CORP1 citations61
US11355415B2Jun 7, 2022
Heat sink-attached power module substrate board and power module
MITSUBISHI MATERIALS CORP0 citations50
US11315868B2Apr 26, 2022
Electronic-component-mounted module design to reduce linear expansion coefficient mismatches
MITSUBISHI MATERIALS CORP0 citations50
US10068829B2Sep 4, 2018
Power-module substrate unit and power module
MITSUBISHI MATERIALS CORP1 citations50
US9837363B2Dec 5, 2017
Power-module substrate unit and power module
MITSUBISHI MATERIALS CORP1 citations50
US9579739B2Feb 28, 2017
Manufacturing method of power-module substrate
MITSUBISHI MATERIALS CORP1 citations50
US11462456B2Oct 4, 2022
Power-module substrate with heat-sink
MITSUBISHI MATERIALS CORP0 citations49
US9725367B2Aug 8, 2017
Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate
MITSUBISHI MATERIALS CORP0 citations39
MATSUURA MASANARI
3 patentsUS8177050B2May 15, 2012
Cooling method of carrying section and carrier
MATSUURA MASANARI2 citations59
US9103594B2Aug 11, 2015
Carrier positioning method and carrier transport system
MATSUURA MASANARI0 citations48
US9033705B2May 19, 2015
Heating furnace and heating method employed by heating furnace
MATSUURA MASANARI0 citations36