Inventor
NISHIKAWA KIMIHITO
JP5 patents
Patents
5 patentsUS9504144B2Nov 22, 2016
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
MITSUBISHI MATERIALS CORP4 citations72
US10607915B2Mar 31, 2020
Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device
MITSUBISHI MATERIALS CORP3 citations70
US9355986B2May 31, 2016
Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer
MITSUBISHI MATERIALS CORP2 citations61
US10375825B2Aug 6, 2019
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
MITSUBISHI MATERIALS CORP0 citations51
US9579739B2Feb 28, 2017
Manufacturing method of power-module substrate
MITSUBISHI MATERIALS CORP1 citations50