Inventor
LI LING-WEI
TW15 patents
⚠️ This page may combine multiple inventors who share the name “LI LING-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
14 patentsUS11948876B2Apr 2, 2024
Package structure with through vias
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11784091B2Oct 10, 2023
Structure and formation method of chip package with fan-out feature
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11456276B2Sep 27, 2022
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11088108B2Aug 10, 2021
Chip package structure including ring-like structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11211318B2Dec 28, 2021
Bump layout for coplanarity improvement
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US12489045B2Dec 2, 2025
Package structure with through vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12381114B2Aug 5, 2025
Package structure with fan-out feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255173B2Mar 18, 2025
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855039B2Dec 26, 2023
Chip package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11569159B2Jan 31, 2023
Structure and formation method of chip package with through vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12183709B2Dec 31, 2024
Chip package structure with ring-like structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11848302B2Dec 19, 2023
Chip package structure with ring-like structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11545463B2Jan 3, 2023
Chip package structure with ring-like structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10770427B1Sep 8, 2020
Chip package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51