Inventor

CHANG JUNG-HUA

TW49 patents

⚠️ This page may combine multiple inventors who share the name “CHANG JUNG-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG JUNG-HUA

TAIWAN SEMICONDUCTOR MFG CO LTD

Plurality of stacked pillar portions on a semiconductor structure

Plurality of stacked pillar portions on a semiconductor structure

Package structure and method of fabricating the same

Non-vertical through-via in package

Package structure including stacked pillar portions

Package structure and method of manufacturing the same

Package structure with through vias

Structure and formation method of chip package with fan-out feature

Chip package structure

Non-vertical through-via in package

Package structure with through vias

Package structure with fan-out feature

Package structure including stacked pillar portions and method for fabricating the same

Chip package structure

Chip package structure

Structure and formation method of chip package with through vias

Package structure and semiconductor pacakge

Non-vertical through-via in package

Semiconductor package structure with twinned copper

Package structure, semiconductor package and method of fabricating the same

Package contact structure, semiconductor package and manufacturing method thereof

Method for forming semiconductor package structure with twinned copper layer

Metal-bump sidewall protection

Metal-bump sidewall protection

Semiconductor package and manufacturing method thereof

Solder bump for ball grid array

Solder bump for ball grid array

Chip package structure and method for forming the same

Metal-bump sidewall protection

SKY TECH INC

Detachable atomic layer deposition apparatus for powders

Atomic layer deposition apparatus for coating on fine powders

Substrate transfer system with tray aligner

Powder atomic layer deposition equipment with quick release function

Alignment mechanism and alignment method of bonding machine

Quantum dot particles with passivation layer and manufacturing method thereof

Bonding method and apparatus of substrates

Bonding machine with movable suction modules

Plate cooling device and de-bonding station with plate cooling device

Atomic layer deposition apparatus for powders

Powder atomic layer deposition apparatus for blowing powders

Atomic layer deposition apparatus for coating on fine powders

2-in-1 (UV-assisted and plasma enhanced) ALD and ALE chamber

Parallelism-adjustable bonding machine

Substrate-bonding device

TAIWAN SEMICONDUCTOR MFG

Method and apparatus for a conductive pillar structure

Method and apparatus for a conductive pillar structure

Method and apparatus for a conductive bump structure

CHANG JUNG-HUA

Solder bump for ball grid array

QDLUX INC

Manufacturing method of optical device, optical device with quantum dots, and illumination apparatus with quantum dots