Inventor
MUELLER BRENNEN
US11 patents
⚠️ This page may combine multiple inventors who share the name “MUELLER BRENNEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS12176323B2Dec 24, 2024
Microelectronic assemblies
INTEL CORP2 citations73
US11393777B2Jul 19, 2022
Microelectronic assemblies
INTEL CORP2 citations73
US11348897B2May 31, 2022
Microelectronic assemblies
INTEL CORP3 citations73
US11721554B2Aug 8, 2023
Stress compensation for wafer to wafer bonding
INTEL CORP2 citations68
US11721649B2Aug 8, 2023
Microelectronic assemblies
INTEL CORP0 citations62
US11532719B2Dec 20, 2022
Transistors on heterogeneous bonding layers
INTEL CORP0 citations62
US11887887B2Jan 30, 2024
Interconnect structures and methods of fabrication
INTEL CORP0 citations59
US11404307B2Aug 2, 2022
Interconnect structures and methods of fabrication
INTEL CORP0 citations59
US11605565B2Mar 14, 2023
Three dimensional integrated circuits with stacked transistors
INTEL CORP0 citations52
US11532558B2Dec 20, 2022
Metallization barrier structures for bonded integrated circuit interfaces
INTEL CORP0 citations49