Inventor

YEH KUNG-CHEN

TW20 patents

⚠️ This page may combine multiple inventors who share the name “YEH KUNG-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEH KUNG-CHEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Dummy die placement without backside chipping

3D packages and methods for forming the same

Dummy die placement without backside chipping

Package structure and method of fabricating the same

Package structure and method of fabricating the same

Apparatus for dicing interposer assembly

Package structure

Package structure and method for forming the same

Package structure and method for forming the same

Package structure and method of fabricating the same

Package structure

Dummy die placement without backside chipping

Semiconductor package and method

Chip package structure with dummy bump and method for forming the same

TAIWAN SEMICONDUCTOR MFG

Package for three dimensional integrated circuit

3D packages and methods for forming the same

Apparatus for dicing interposer assembly

WANG CHUNG YU

Apparatus and methods for dicing interposer assembly

Methods for de-bonding carriers

CHEN CHIH-HAO

Package for three dimensional integrated circuit