Inventor

TSAI TSUNG-FU

TW71 patents

⚠️ This page may combine multiple inventors who share the name “TSAI TSUNG-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI TSUNG-FU

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated fan-out packages and methods of forming the same

Package structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Package structure and method of manufacturing the same

Package structure and method of fabricating the same

Package structure and method of fabricating the same

Structure and formation method of package structure with underfill

Integrated circuit packages and methods for forming the same

Integrated circuit packages and methods for forming the same

Integrated circuit packages and methods for forming the same

Package structure

Package structure and manufacturing method thereof

Package structure and method for forming the same

Package structure and method for forming the same

Methods and apparatus of packaging semiconductor devices

Electronic device and manufacturing method thereof

Package structure and method of fabricating the same

Package assembly including a package lid having an inner foot and methods of making the same

Semiconductor package and manufacturing method thereof

Package structure and method of fabricating the same

Package structure and method of manufacturing the same

Package structure and method of fabricating the same

Package structure and method of fabricating the same

Package structure and method of fabricating the same

Package structure and method of fabricating the same

Package structure with underfill

Method of singulating a semiconductor device

Semiconductor package and manufacturing method thereof

Package structure and method of fabricating the same

Device bonding apparatus and method of manufacturing a package using the apparatus

Pickup apparatus and method of using the same

Package structure and manufacturing method thereof

Package structure

Semiconductor package and manufacturing method thereof

Package structure with underfill

Method of fabricating semiconductor device having dummy micro bumps between stacking dies

Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material

TAIWAN SEMICONDUCTOR MFG

Post-passivation interconnect structure and methods for forming the same

Packaging devices, methods of manufacture thereof, and packaging methods

Semiconductor device having under-bump metallization (UBM) structure and method of forming the same

Semiconductor device having under-bump metallization (UBM) structure and method of forming the same

Methods and apparatus of packaging semiconductor devices

Isolation rings for packages and the method of forming the same

TSAI TSUNG-FU

Under-bump metallization (UBM) structure and method of forming the same

Package carrier

Protecting flip-chip package using pre-applied fillet

Metal bump structure

TU CHIA-WEI

Integrated circuit packages and methods for forming the same

Methods and apparatus of under bump metallization in packaging semiconductor devices

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

Structure and formation method of package with hybrid interconnection