Inventor

HARTNER WALTER

DE66 patents

⚠️ This page may combine multiple inventors who share the name “HARTNER WALTER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HARTNER WALTER

INFINEON TECHNOLOGIES AG

Semiconductor packages with integrated antenna and method of forming thereof

Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound

Semiconductor component having at least one capacitor and methods for fabricating it

Semiconductor structure and method

Ferroelectric random access memory (FeRAM) having storage capacitors with different coercive voltages

Wireless communication system, a radar system and a method for determining a position information of an object

Semiconductor component including an isolation structure and a contact to the substrate

Method for preventing etching-induced damage to a metal oxide film by patterning the film after a nucleation anneal but while still amorphous and then thermally annealing to crystallize

Method of producing a ferroelectric semiconductor memory

Method for fabricating a microelectronic component

Process for producing structured layers, process for producing components of an integrated circuit, and process for producing a memory configuration

Method for the production of an integrated semiconductor memory configuration

Method for producing barrier-free semiconductor memory configurations

Production process for a capacitor electrode formed of a platinum metal

Chip package with substrate integrated waveguide and waveguide interface

Embedded chip packages and methods for manufacturing an embedded chip package

Embedded chip packages and methods for manufacturing an embedded chip package

Method for fabricating a semiconductor memory device

Method for fabricating a semiconductor memory device

Method for fabricating an integrated semiconductor circuit having a strongly polarizable dielectric or ferroelectric

Method for producing a ferroelectric layer

Semiconductor device having an antenna arranged over an active main surface of a semiconductor die

Method of patterning ferroelectric layers

Easy to manufacture integrated semiconductor memory configuration with platinum electrodes

Radio-frequency devices and methods for producing radio-frequency devices

Transmission of wireless signal having information on a local oscillator signal

Radio-frequency devices and associated production methods

RF devices including an RF chip having an electrical redistribution layer with RF antennas formed therein and methods of manufacture

Semiconductor package with integrated microwave component

Microelectronic structure having a hydrogen barrier layer

Method of manufacturing a ferroelectric capacitor configuration

Method for producing a semiconductor structure, and use of the method

Method for fabricating a patterned layer

Method of manufacture of a capacitor with a dielectric on the basis of strontium-bismuth-tantalum

Process for producing high-epsilon dielectric layer or ferroelectric layer

Semiconductor package with plastic waveguide

Semiconductor devices having a non-galvanic connection

High frequency devices including attenuating dielectric materials

Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component

SIEMENS AG

Semiconductor configuration with a protected barrier for a stacked cell

Method of producing a platinum-metal pattern or structure by a lift-off process

Memory configuration with self-aligning non-integrated capacitor configuration

SYMETRIX CORP

Process for fabricating layered superlattice materials and AB03 type metal oxides without exposure to oxygen at high temperatures

Recovery of electronic properties in hydrogen-damaged ferroelectrics by low-temperature annealing in an inert gas

Recovery of electronic properties in process-damaged ferroelectrics by voltage-cycling

MEISER ANDREAS

Semiconductor component and methods for producing a semiconductor component

Semiconductor component and methods for producing a semiconductor component

GEITNER OTTMAR

Chip package and a method for manufacturing a chip package

INFINCON TECHNOLOGIES AG

Method for fabricating a patterned metal-oxide-containing layer

HIRTREITER JOSEF

Method of fabricating a chip package