Inventor
PANCHOLI ANUP
US24 patents
⚠️ This page may combine multiple inventors who share the name “PANCHOLI ANUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
19 patentsUS11251158B2Feb 15, 2022
Monolithic chip stacking using a die with double-sided interconnect layers
INTEL CORP4 citations84
US10439101B2Oct 8, 2019
Micro light-emitting diode (LED) elements and display
INTEL CORP7 citations84
US10361337B2Jul 23, 2019
Micro light-emitting diode (LED) display and fluidic self-assembly of same
INTEL CORP11 citations84
US11177243B2Nov 16, 2021
Micro light-emitting diode display fabrication and assembly
INTEL CORP2 citations73
US11037817B2Jun 15, 2021
Apparatus with multi-wafer based device and method for forming such
INTEL CORP4 citations73
US10923622B2Feb 16, 2021
Micro light-emitting diode (LED) elements and display
INTEL CORP2 citations73
US12463180B2Nov 4, 2025
Monolithic chip stacking using a die with double-sided interconnect layers
INTEL CORP0 citations62
US12362325B2Jul 15, 2025
Monolithic chip stacking using a die with double-sided interconnect layers
INTEL CORP0 citations62
US11948831B2Apr 2, 2024
Apparatus with multi-wafer based device and method for forming such
INTEL CORP1 citations62
US11908687B2Feb 20, 2024
III-N multichip modules and methods of fabrication
INTEL CORP0 citations62
US11784165B2Oct 10, 2023
Monolithic chip stacking using a die with double-sided interconnect layers
INTEL CORP0 citations62
US11610936B2Mar 21, 2023
Micro light-emitting diode displays having color conversion devices and assembly approaches
INTEL CORP0 citations62
US11245053B2Feb 8, 2022
Micro-LED structures for full color displays and methods of manufacturing the same
INTEL CORP0 citations62
US11211245B2Dec 28, 2021
III-N multichip modules and methods of fabrication
INTEL CORP0 citations62
US11037916B2Jun 15, 2021
Apparatus with multi-wafer based device comprising embedded active devices and method for forming such
INTEL CORP1 citations62
US12389728B2Aug 12, 2025
Micro-LED displays including solder structures and methods
INTEL CORP0 citations52
US11659722B2May 23, 2023
Thin-film-transistor based complementary metal-oxide-semiconductor (CMOS) circuit
INTEL CORP0 citations52
US10714446B2Jul 14, 2020
Apparatus with multi-wafer based device comprising embedded active and/or passive devices and method for forming such
INTEL CORP0 citations52
US11637093B2Apr 25, 2023
Micro light-emitting diode display fabrication and assembly
INTEL CORP0 citations47
APPLIED MATERIALS INC
3 patentsUS12444707B2Oct 14, 2025
Method for collective dishing of singulated dies
APPLIED MATERIALS INC0 citations61
US12487417B2Dec 2, 2025
Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuit
APPLIED MATERIALS INC0 citations51
US12345934B2Jul 1, 2025
Methods for fabrication of optical structures on photonic glass layer substrates
APPLIED MATERIALS INC0 citations51