Inventor

JI ZHONGLI

CN10 patents

⚠️ This page may combine multiple inventors who share the name “JI ZHONGLI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANDISK INFORMATION TECH SHANGHAI CO LTD

2 patents

US10236276B2Mar 19, 2019

Semiconductor device including vertically integrated groups of semiconductor packages

SANDISK INFORMATION TECH SHANGHAI CO LTD4 citations67

US10818575B2Oct 27, 2020

Datacenter 3D solid state drives with matrix cooling

SANDISK INFORMATION TECH SHANGHAI CO LTD0 citations51

UNIV CHINA PETROLEUM BEIJING

2 patents

US12478909B2Nov 25, 2025

Coalescing filter element

UNIV CHINA PETROLEUM BEIJING0 citations51

US12447432B2Oct 21, 2025

Switchable two-stage coalescence separation system

UNIV CHINA PETROLEUM BEIJING0 citations51

CHINA UNIV OF PETROLEUM-BEIJING (CUPB)

2 patents

US9409113B2Aug 9, 2016

Self-oscillating nozzle and pulse-jet cleaning system with the same

CHINA UNIV OF PETROLEUM-BEIJING (CUPB)1 citations42

US9802147B2Oct 31, 2017

Filter tube for high temperature gas-solid separation

CHINA UNIV OF PETROLEUM-BEIJING (CUPB)0 citations32

SANDISK TECHNOLOGIES LLC

1 patent

US10854573B2Dec 1, 2020

Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch

SANDISK TECHNOLOGIES LLC14 citations84

SANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD

1 patent

US9230942B2Jan 5, 2016

Semiconductor device including alternating stepped semiconductor die stacks

SANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD6 citations69

WESTERN DIGITAL TECH INC

1 patent

US12154860B2Nov 26, 2024

Method of forming a semiconductor device including vertical contact fingers

WESTERN DIGITAL TECH INC0 citations60

HUAWEI TECH CO LTD

1 patent

US12532744B2Jan 20, 2026

Packaging module including electromagnetic shielding structure having conductive pillars and conductive adhesive, and packaging method therefor

HUAWEI TECH CO LTD0 citations45