Inventor
OGGIONI STEFANO
IT13 patents
Patents
13 patentsUS5825628AOct 20, 1998
Electronic package with enhanced pad design
IBM115 citations95
US6967398B2Nov 22, 2005
Module power distribution network
IBM21 citations92
US6717255B2Apr 6, 2004
Chip carrier for a high-frequency electronic package
IBM21 citations90
US6710258B2Mar 23, 2004
Circuitized substrate for high-frequency applications
IBM45 citations90
US6639304B1Oct 28, 2003
Ball grid array module
IBM19 citations90
US7319197B2Jan 15, 2008
Structure of stacked vias in multiple layer electrode device carriers
IBM28 citations89
US10153250B2Dec 11, 2018
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
IBM6 citations83
US6398081B2Jun 4, 2002
Volumetric pump
IBM11 citations70
US6049464AApr 11, 2000
Electronic modules manufacturing
IBM11 citations70
US11251160B2Feb 15, 2022
Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
IBM0 citations62
US10886254B2Jan 5, 2021
Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
IBM0 citations62
US6806122B2Oct 19, 2004
Ball grid array module
IBM5 citations60
US7070085B2Jul 4, 2006
Water soluble protective paste for manufacturing printed circuit boards
IBM0 citations51