Inventor
NABORS MARNI
US11 patents
Patents
11 patentsUS11373999B2Jun 28, 2022
Deep trench via for three-dimensional integrated circuit
INTEL CORP3 citations73
US11410928B2Aug 9, 2022
Device layer interconnects
INTEL CORP1 citations72
US11068640B2Jul 20, 2021
Power shared cell architecture
INTEL CORP3 citations68
US12051692B2Jul 30, 2024
Integrated circuit structure with front side signal lines and backside power delivery
INTEL CORP4 citations67
US12532538B2Jan 20, 2026
Integrated circuit structures having conductive structures in fin isolation regions
INTEL CORP0 citations62
US12519058B2Jan 6, 2026
Device layer interconnects
INTEL CORP0 citations62
US12419085B2Sep 16, 2025
Integrated circuit structures having backside gate tie-down
INTEL CORP0 citations62
US12100705B2Sep 24, 2024
Deep trench via for three-dimensional integrated circuit
INTEL CORP0 citations62
US11881452B2Jan 23, 2024
Device layer interconnects
INTEL CORP0 citations62
US12476205B2Nov 18, 2025
Rectilinear seams between adjacent fields of a die for improved layout efficiency
INTEL CORP0 citations58
US11682664B2Jun 20, 2023
Standard cell architecture with power tracks completely inside a cell
INTEL CORP0 citations55