Inventor
LEWISON DAVID J
US10 patents
Patents
10 patentsUS10842043B1Nov 17, 2020
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins
IBM22 citations91
US11156409B2Oct 26, 2021
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
IBM6 citations71
US11158562B2Oct 26, 2021
Conformal integrated circuit (IC) device package lid
IBM1 citations61
US12005148B2Jun 11, 2024
Coolant-cooled heat sink(s) with associated ultra-violet light assembly
IBM0 citations60
US11940271B2Mar 26, 2024
High power device fault localization via die surface contouring
IBM0 citations60
US12581600B2Mar 17, 2026
Generation of random security circuit patterns for in-situ fabrication of tamper-respondent sensors
IBM0 citations59
US11614324B2Mar 28, 2023
Non-destructive bond line thickness measurement of thermal interface material on silicon packages
IBM0 citations59
US11430710B2Aug 30, 2022
Lid/heat spreader having targeted flexibility
IBM0 citations59
US11716808B2Aug 1, 2023
Tamper-respondent assemblies with porous heat transfer element(s)
IBM0 citations49
US9673177B1Jun 6, 2017
Selectively soluble standoffs for chip joining
IBM0 citations41