Inventor
SIM SUNG-MIN
KR13 patents
Patents
13 patentsUS5753532AMay 19, 1998
Method of manufacturing semiconductor chip package
SAMSUNG ELECTRONICS CO LTD197 citations98
US7151009B2Dec 19, 2006
Method for manufacturing wafer level chip stack package
SAMSUNG ELECTRONICS CO LTD356 citations97
US7307342B2Dec 11, 2007
Interconnection structure of integrated circuit chip
SAMSUNG ELECTRONICS CO LTD16 citations92
US5840614ANov 24, 1998
Method of producing a semiconductor wafer using ultraviolet sensitive tape
SAMSUNG ELECTRONICS CO LTD40 citations90
US7205660B2Apr 17, 2007
Wafer level chip scale package having a gap and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7855144B2Dec 21, 2010
Method of forming metal lines and bumps for semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations73
US7312143B2Dec 25, 2007
Wafer level chip scale package having a gap and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US5933708AAug 3, 1999
Lead-on-chip semiconductor package and method for making the same
SAMSUNG ELECTRONICS CO LTD13 citations73
US6423654B1Jul 23, 2002
Method of manufacturing a semiconductor device having silicon oxynitride passavation layer
SAMSUNG ELECTRONICS CO LTD10 citations71
US5543493AAug 6, 1996
Method for treating a polyimide surface
SAMSUNG ELECTRONICS CO LTD17 citations70
US7825495B2Nov 2, 2010
Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package
SAMSUNG ELECTRONICS CO LTD2 citations62
US7732319B2Jun 8, 2010
Interconnection structure of integrated circuit chip
SAMSUNG ELECTRONICS CO LTD2 citations62
US7524763B2Apr 28, 2009
Fabrication method of wafer level chip scale packages
SAMSUNG ELECTRONICS CO LTD4 citations61