Inventor

MARTORELL FERRAN

ES9 patents

⚠️ This page may combine multiple inventors who share the name “MARTORELL FERRAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ESILICON CORP

6 patents

US9454636B1Sep 27, 2016

MARVELL ASIA PTE LTD

2 patents

US11942409B2Mar 26, 2024

High density low power interconnect using 3D die stacking

MARVELL ASIA PTE LTD0 citations60

US11233002B2Jan 25, 2022

High density low power interconnect using 3D die stacking

MARVELL ASIA PTE LTD1 citations60

CORTADELLA JORDI

1 patent

US8433875B2Apr 30, 2013

Asynchronous scheme for clock domain crossing

CORTADELLA JORDI7 citations78

MARTORELL FERRAN

ESILICON CORP

Integrated circuit design optimization

Scaling memory components of integrated circuit design

Scaling logic components of integrated circuit design

Scaling of integrated circuit design including high-level logic components

Scaling of integrated circuit design including logic and memory components

Integrated circuit design scaling for recommending design point

MARVELL ASIA PTE LTD

High density low power interconnect using 3D die stacking

High density low power interconnect using 3D die stacking

CORTADELLA JORDI

Asynchronous scheme for clock domain crossing