Inventor
LIAW H MING
US10 patents
Patents
10 patentsUS5260596ANov 9, 1993
Monolithic circuit with integrated bulk structure resonator
MOTOROLA INC124 citations97
US5091330AFeb 25, 1992
Method of fabricating a dielectric isolated area
MOTOROLA INC105 citations95
US4962051AOct 9, 1990
Method of forming a defect-free semiconductor layer on insulator
MOTOROLA INC64 citations95
US4200621AApr 29, 1980
Sequential purification and crystal growth
MOTOROLA INC85 citations95
US5281834AJan 25, 1994
Non-silicon and silicon bonded structure and method of manufacture
MOTOROLA INC68 citations94
US5064781ANov 12, 1991
Method of fabricating integrated silicon and non-silicon semiconductor devices
MOTOROLA INC39 citations91
US5310689AMay 10, 1994
Method of forming a SIMOX structure
MOTOROLA INC35 citations90
US5143858ASep 1, 1992
Method of fabricating buried insulating layers
MOTOROLA INC20 citations80
US4557795ADec 10, 1985
Melt recharge method
MOTOROLA INC8 citations67
US4394352AJul 19, 1983
Melt recharge apparatus
MOTOROLA INC11 citations67