Inventor
STEIERT MATTHIAS
US15 patents
⚠️ This page may combine multiple inventors who share the name “STEIERT MATTHIAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
11 patentsUS9475691B1Oct 25, 2016
Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
INFINEON TECHNOLOGIES AG14 citations80
US10549985B2Feb 4, 2020
Semiconductor package with a through port for sensor applications
INFINEON TECHNOLOGIES AG4 citations71
US10486961B2Nov 26, 2019
Method for producing a MEMS sensor, and MEMS sensor
INFINEON TECHNOLOGIES AG2 citations71
US10616703B2Apr 7, 2020
MEMS sound transducer element and method for producing a MEMS sound transducer element
INFINEON TECHNOLOGIES AG1 citations62
US11342298B2May 24, 2022
Die stack arrangement comprising a die-attach-film tape and method for producing same
INFINEON TECHNOLOGIES AG0 citations56
US11402556B2Aug 2, 2022
Wafer level method for manufacturing integrated infrared (IR) emitter elements having an optical IR filter placed on the main surface region of the carrier substrate on which the IR emitter is formed
INFINEON TECHNOLOGIES AG0 citations51
US10377626B2Aug 13, 2019
Apparatus with a high heat capacity and method for producing the same
INFINEON TECHNOLOGIES AG0 citations51
US10793429B2Oct 6, 2020
Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly
INFINEON TECHNOLOGIES AG0 citations49
US10584028B2Mar 10, 2020
Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly
INFINEON TECHNOLOGIES AG0 citations49
US10861818B2Dec 8, 2020
Die stack arrangement comprising a die-attach-film tape and method for producing same
INFINEON TECHNOLOGIES AG0 citations45
US10155657B2Dec 18, 2018
Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening
INFINEON TECHNOLOGIES AG1 citations42