Inventor
INDYK RICHARD FRANCIS
US4 patents
Patents
4 patentsUS6376054B1Apr 23, 2002
Surface metallization structure for multiple chip test and burn-in
IBM5 citations61
US11521952B2Dec 6, 2022
Spacer for die-to-die communication in an integrated circuit and method for fabricating the same
IBM0 citations59
US11031373B2Jun 8, 2021
Spacer for die-to-die communication in an integrated circuit
IBM1 citations59
US11031343B2Jun 8, 2021
Fins for enhanced die communication
IBM0 citations48