Inventor
Tseng Guan-Syun
TW6 patents
Patents
6 patentsUS11008456B2May 18, 2021
Resin composition and uses of the same
TAIWAN UNION TECHNOLOGY CORP0 citations60
US11339258B2May 24, 2022
Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
TAIWAN UNION TECHNOLOGY CORP0 citations49
US11414532B2Aug 16, 2022
Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same
TAIWAN UNION TECHNOLOGY CORP0 citations48
US11643544B2May 9, 2023
Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
TAIWAN UNION TECHNOLOGY CORP0 citations47
US10920008B2Feb 16, 2021
Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same
TAIWAN UNION TECHNOLOGY CORP0 citations46
US10563006B2Feb 18, 2020
Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
TAIWAN UNION TECHNOLOGY CORP0 citations36