Inventor
MORTENSEN RUSSELL K
US7 patents
⚠️ This page may combine multiple inventors who share the name “MORTENSEN RUSSELL K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS10607976B2Mar 31, 2020
Offset interposers for large-bottom packages and large-die package-on-package structures
INTEL CORP6 citations83
US12107082B2Oct 1, 2024
Offset interposers for large-bottom packages and large-die package-on-package structures
INTEL CORP2 citations72
US11978730B2May 7, 2024
Offset interposers for large-bottom packages and large-die package-on-package structures
INTEL CORP1 citations72
US11798932B2Oct 24, 2023
Offset interposers for large-bottom packages and large-die package-on-package structures
INTEL CORP1 citations72
US10453799B2Oct 22, 2019
Logic die and other components embedded in build-up layers
INTEL CORP2 citations70
US9496211B2Nov 15, 2016
Logic die and other components embedded in build-up layers
INTEL CORP5 citations70