Inventor

YU BONG WEE

KR2 patents

⚠️ This page may combine multiple inventors who share the name “YU BONG WEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

1 patent

US12532784B2Jan 20, 2026

Integrated circuit chip and semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations58

YU BONG-WEE

1 patent

US7327797B2Feb 5, 2008

Orthogonal frequency division multiplexing (OFDM) receiving device for forming beam with uneven width by channel property, communication device using the same, and method thereof

YU BONG-WEE5 citations53