Inventor
CONROD JAY B
US4 patents
Patents
4 patentsUS5376248ADec 27, 1994
Direct metallization process
ENTHONE OMI INC20 citations87
US5358602AOct 25, 1994
Method for manufacture of printed circuit boards
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US5998237ADec 7, 1999
Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion
ENTHONE OMI INC15 citations67
US5368718ANov 29, 1994
Electrowinning of direct metallization accelerators
ENTHONE OMI INC4 citations55