Inventor
WU TIEN Y
US7 patents
Patents
7 patentsUS5574630ANov 12, 1996
Laminated electronic package including a power/ground assembly
IBM189 citations98
US5491610AFeb 13, 1996
Electronic package having active means to maintain its operating temperature constant
IBM131 citations95
US6246124B1Jun 12, 2001
Encapsulated chip module and method of making same
IBM30 citations92
US5442144AAug 15, 1995
Multilayered circuit board
IBM25 citations92
US5359767ANov 1, 1994
Method of making multilayered circuit board
IBM24 citations92
US5532024AJul 2, 1996
Method for improving the adhesion of polymeric adhesives to nickel surfaces
IBM36 citations90
US6558981B2May 6, 2003
Method for making an encapsulated semiconductor chip module
IBM7 citations73