Inventor
DUTSON JOSEPH D
US5 patents
Patents
5 patentsUS6882536B2Apr 19, 2005
Wrap-around cooling arrangement for printed circuit board
HEWLETT PACKARD DEVELOPMENT CO34 citations91
US6791184B2Sep 14, 2004
Support assembly for an integrated circuit package having solder columns
HEWLETT PACKARD DEVELOPMENT CO13 citations81
US6710264B2Mar 23, 2004
Method and apparatus for supporting a circuit component having solder column interconnects using external support
HEWLETT PACKARD DEVELOPMENT CO2 citations60
US7273386B2Sep 25, 2007
Pin shroud
HEWLETT PACKARD DEVELOPMENT CO2 citations54
US7434309B2Oct 14, 2008
Method and apparatus for supporting a circuit component having solder column interconnects using an external support
HEWLETT PACKARD DEVELOPMENT CO1 citations49