Inventor
OHMIYA NAOKI
JP8 patents
Patents
8 patentsUS7265033B2Sep 4, 2007
Laser beam processing method for a semiconductor wafer
DISCO CORP138 citations97
US6726526B2Apr 27, 2004
Cutting machine
DISCO CORP22 citations92
US6010396AJan 4, 2000
Blade cover in a cutting apparatus
DISCO CORP22 citations91
US7179722B2Feb 20, 2007
Wafer dividing method
DISCO CORP20 citations84
US7557904B2Jul 7, 2009
Wafer holding mechanism
DISCO CORP12 citations83
US7063083B2Jun 20, 2006
Wafer dividing method and apparatus
DISCO CORP8 citations73
US7602071B2Oct 13, 2009
Apparatus for dividing an adhesive film mounted on a wafer
DISCO CORP3 citations62
US7449396B2Nov 11, 2008
Wafer dividing method
DISCO CORP4 citations62