P

Inventor

CHONG CHI MING

HK10 patents
⚠️ This page may combine multiple inventors who share the name “CHONG CHI MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASM ASSEMBLY AUTOMATION LTD

3 patents
US7240422B2Jul 10, 2007

Apparatus for semiconductor chip detachment

ASM ASSEMBLY AUTOMATION LTD30 citations88
US7182118B2Feb 27, 2007

Pick and place assembly for transporting a film of material

ASM ASSEMBLY AUTOMATION LTD18 citations83
US8026126B2Sep 27, 2011

Apparatus and method for thin die detachment

ASM ASSEMBLY AUTOMATION LTD4 citations57

YUNG CHUNG SHEUNG

2 patents
US8387851B1Mar 5, 2013

Apparatus for aligning a bonding tool of a die bonder

YUNG CHUNG SHEUNG9 citations79
US8875979B2Nov 4, 2014

Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck

YUNG CHUNG SHEUNG4 citations70

CHAN MAN WAI

1 patent
US8141612B2Mar 27, 2012

Device for thin die detachment and pick-up

CHAN MAN WAI12 citations79

CHONG CHI MING

1 patent
US8470130B2Jun 25, 2013

Universal die detachment apparatus

CHONG CHI MING15 citations76

YIP SIU PING

1 patent
US8092645B2Jan 10, 2012

Control and monitoring system for thin die detachment and pick-up

YIP SIU PING17 citations75

LEUNG MEI PO

1 patent
US9318362B2Apr 19, 2016

Die bonder and a method of cleaning a bond collet

LEUNG MEI PO15 citations70

ASMPT SINGAPORE PTE LTD

1 patent
US12525571B1Jan 13, 2026

Compliant locating structure for a bond head assembly

ASMPT SINGAPORE PTE LTD0 citations52