P

Inventor

LEE HUNG-JEN

TW6 patents
⚠️ This page may combine multiple inventors who share the name “LEE HUNG-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

XINTEC INC

3 patents
US8779558B2Jul 15, 2014

Chip package structure and manufacturing method thereof

XINTEC INC2 citations61
US9054114B2Jun 9, 2015

Chip package structure and manufacturing method thereof

XINTEC INC0 citations51
US8928098B2Jan 6, 2015

Semiconductor package and fabrication method thereof

XINTEC INC0 citations51

LEE HUNG-JEN

2 patents
US8673686B2Mar 18, 2014

Chip package structure and manufacturing method thereof

LEE HUNG-JEN7 citations81
US8409925B2Apr 2, 2013

Chip package structure and manufacturing method thereof

LEE HUNG-JEN8 citations81

YIU HO-YIN

1 patent
US8791768B2Jul 29, 2014

Capacitive coupler packaging structure

YIU HO-YIN4 citations69