Inventor

POH ZI SONG

MY6 patents

⚠️ This page may combine multiple inventors who share the name “POH ZI SONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FOONG CHEE SENG

1 patent

US9209147B1Dec 8, 2015

Method of forming pillar bump

FOONG CHEE SENG6 citations69

NXP USA INC

1 patent

US10654709B1May 19, 2020

Shielded semiconductor device and lead frame therefor

NXP USA INC1 citations58

NGION LEE FEE

1 patent

US9209144B1Dec 8, 2015

Substrate with electrically isolated bond pads

NGION LEE FEE2 citations50

SIONG CHIN TECK

1 patent

US9165904B1Oct 20, 2015

Insulated wire bonding with EFO before second bond

SIONG CHIN TECK0 citations42

FREESCALE SEMICONDUCTOR INC

1 patent

US9698093B2Jul 4, 2017

Universal BGA substrate

FREESCALE SEMICONDUCTOR INC0 citations38

ONG LI TING CELINA

1 patent

US8450841B2May 28, 2013

Bonded wire semiconductor device

ONG LI TING CELINA0 citations34