Inventor
CHU HENG-CHENG
TW12 patents
⚠️ This page may combine multiple inventors who share the name “CHU HENG-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
10 patentsUS8963299B2Feb 24, 2015
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD8 citations82
US10230152B2Mar 12, 2019
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations72
US11476572B2Oct 18, 2022
Method for fabricating electronic package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US10587041B2Mar 10, 2020
Electronic package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations60
US10587037B2Mar 10, 2020
Electronic package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9997477B2Jun 12, 2018
Method of manufacturing semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9337250B2May 10, 2016
Semiconductor package and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US8962396B2Feb 24, 2015
Fabrication method of carrier-free semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10199731B2Feb 5, 2019
Electronic component
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9627748B2Apr 18, 2017
Electronic component
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49