Inventor
HORIGOME KATSUHIKO
JP8 patents
Patents
8 patentsUS10460973B2Oct 29, 2019
Adhesive tape for semiconductor processing and method for producing semiconductor device
LINTEC CORP7 citations78
US7105226B2Sep 12, 2006
Pressure sensitive adhesive double coated sheet and method of use thereof
LINTEC CORP8 citations68
US11183416B2Nov 23, 2021
Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
LINTEC CORP0 citations59
US7361971B2Apr 22, 2008
Semiconductor wafer protection structure and laminated protective sheet for use therein
LINTEC CORP1 citations51
US12408551B2Sep 2, 2025
Thermoelectric conversion module
LINTEC CORP0 citations50
US10825790B2Nov 3, 2020
Protective film for semiconductors, semiconductor device, and composite sheet
LINTEC CORP0 citations48
US10879104B2Dec 29, 2020
Adhesive tape for semiconductor processing and method for producing semiconductor device
LINTEC CORP0 citations46
US10086594B2Oct 2, 2018
Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device
LINTEC CORP0 citations44