Inventor
LEE SUNGUK
KR5 patents
⚠️ This page may combine multiple inventors who share the name “LEE SUNGUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
4 patentsUS12176308B2Dec 24, 2024
Package substrate and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations55
US11756908B2Sep 12, 2023
Package substrate including a redistribution pad extending from a redistribution layer and including segmenting grooves along a redial direction thereof and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations55
US11302661B2Apr 12, 2022
Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations55
US11264339B2Mar 1, 2022
Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations55