Inventor

HO FOONG YUE

MY3 patents

⚠️ This page may combine multiple inventors who share the name “HO FOONG YUE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SPANSION LLC

2 patents

US8357563B2Jan 22, 2013

Stitch bump stacking design for overall package size reduction for multiple stack

SPANSION LLC5 citations65

US7932131B2Apr 26, 2011

Reduction of package height in a stacked die configuration

SPANSION LLC4 citations54

CHIN LAI NGUK

1 patent

US8680686B2Mar 25, 2014

Method and system for thin multi chip stack package with film on wire and copper wire

CHIN LAI NGUK0 citations26