Inventor

NAM WONG KWET

MY4 patents

⚠️ This page may combine multiple inventors who share the name “NAM WONG KWET”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SPANSION LLC

2 patents

US8357563B2Jan 22, 2013

Stitch bump stacking design for overall package size reduction for multiple stack

SPANSION LLC5 citations65

US7799612B2Sep 21, 2010

Process applying die attach film to singulated die

SPANSION LLC0 citations38

ADVANCED MICRO DEVICES INC

1 patent

US7157376B1Jan 2, 2007

Method and apparatus for handling thin semiconductor wafers

ADVANCED MICRO DEVICES INC2 citations52

CHIN LAI NGUK

1 patent

US8680686B2Mar 25, 2014

Method and system for thin multi chip stack package with film on wire and copper wire

CHIN LAI NGUK0 citations26