P

Inventor

Huang meiquan

CN6 patents
⚠️ This page may combine multiple inventors who share the name “Huang meiquan”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Huang meiquan

3 patents
US8288847B2Oct 16, 2012

Dual die semiconductor package

Huang meiquan4 citations56
US8878348B2Nov 4, 2014

Semiconductor device and method of assembling same

Huang meiquan0 citations44
US8524529B2Sep 3, 2013

Brace for wire bond

Huang meiquan0 citations43

ZONG FEI

1 patent
US8496158B2Jul 30, 2013

Method and apparatus for monitoring free air ball (FAB) formation in wire bonding

ZONG FEI3 citations51

WANG HUAN

1 patent
US8907464B2Dec 9, 2014

Helix substrate and three-dimensional package with same

WANG HUAN1 citations48

FREESCALE SEMICONDUCTOR INC

1 patent
US9129948B2Sep 8, 2015

Semiconductor device and method of assembling same

FREESCALE SEMICONDUCTOR INC0 citations46