Inventor
TSENG AN-PING
TW7 patents
⚠️ This page may combine multiple inventors who share the name “TSENG AN-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK TAIWAN CORP
3 patents(unassigned)
2 patentsKINSUS INTERCONNECT TECH CORP
2 patentsUS9301405B1Mar 29, 2016
Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole
KINSUS INTERCONNECT TECH CORP10 citations81
US9439292B1Sep 6, 2016
Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure
KINSUS INTERCONNECT TECH CORP9 citations80